Die Bonder Z-Axis Lifts

Die bonders perform one of the most delicate and vital steps in semiconductor assembly by attaching individual chips to substrates with extreme accuracy and control. The Z-axis lift mechanisms within these systems must execute micron-level vertical motion to place dies gently and precisely during chip attach and wire bonding.
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Lift Precisely. Place Confidently. Build the Bond That Lasts.

Helix Linear Technologies supplies miniature actuators and precision lead screws designed for vertical positioning in die bonding applications. Our motion components offer smooth travel, low backlash, and high repeatability to deliver the gentle force and fine resolution required for precise die placement without damage or misalignment.



With compact footprints, cleanroom-compatible materials, and customizable travel lengths, Helix solutions help OEMs build high-throughput, high-yield bonding equipment for advanced semiconductor packaging.



Key Benefits:



  • Sub-micron Z-axis motion for precise die and bonding head placement
  • Smooth, controlled lift to minimize die stress or tilt
  • Compact, high-precision components for dense, multi-axis bonding tools
  • Cleanroom-grade construction ensures contamination-free operation





Helix provides the motion behind every perfect placement to support strong bonds, higher yields, and next-generation chip packaging.



Product Groups

Custom Motion Components for Semiconductor OEMs



Helix Linear Technologies partners with semiconductor equipment OEMs to develop custom lead screws, ball screws, linear actuators, and guide systems tailored for the industry’s most demanding applications. Our components are engineered to resist harsh chemicals, and maintain sub-micron repeatability across millions of cycles.



Whether you’re building wafer processing equipment, automated inspection systems, or high-throughput backend packaging tools, Helix delivers the motion systems that keep semiconductor manufacturing precise, scalable, and future-ready.



Key Benefits:



✦ Sub-micron precision motion for wafer alignment, inspection, and bonding

✦ Cleanroom-compatible designs with low particle generation and dry lubrication

✦ Corrosion- and heat-resistant materials for vacuum, plasma, and chemical exposure

✦ Custom-engineered solutions to integrate seamlessly into OEM equipment





From lithography to laser dicing, Helix powers the motion behind the world’s most advanced semiconductor tools.



Whitepaper
WHITEPAPERSEMICONDUCTORS

Solutions for Semiconductor Manufacturing

Precision Motion Systems for a Demanding Industry

Testimonials

Precision That Powers Automation

"Your stepper motor linear actuators deliver unparalleled performance and precision, a game-changer for our automation needs."

Alan Perry, Stryker
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Driving Innovation Through Collaboration

"The level of responsiveness from your sales engineer and the innovative engineering support provided during the purchase of our custom lead screw were outstanding. Our partnership has truly elevated our product development."

Ken Matthews, Johnson & Johnson
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Expert Support for Complex Medical Engineering

"Your team's customer service went above and beyond, guiding us through the intricate process of custom ball screw engineering. The result? A precision-engineered ball screw that seamlessly integrated into our medical equipment, enhancing its reliability and performance. Kudos to your expertise and exceptional support.”"

John Sidlow, GE Medical
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