Dicing Saw Positioning Modules

Dicing saws are used to separate individual semiconductor dies from fully processed wafers, using precision blades or lasers to make micron-scale cuts. To avoid chipping, cracking, or yield loss, these systems require ultra-precise motion to guide the cutting tool along exact paths.
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Cut Precisely. Align Confidently. Maximize Die Yield.

Helix Linear Technologies provides high-precision lead screws, ball screws, and actuators that control the motion of dicing saw blades and laser heads. Our motion systems offer fine resolution, minimal backlash, and smooth travel to ensure that every cut is straight, shallow, and repeatable across hundreds of dies.



With cleanroom-grade materials and low-vibration performance, Helix components support OEMs building high-speed, high-accuracy dicing and singulation tools for advanced semiconductor packaging lines.



Key Benefits:



  • Sub-micron positioning accuracy for blade or laser alignment
  • Smooth, low-vibration motion minimizes wafer stress and die damage
  • Precision-engineered screws and actuators for repeatable slicing patterns
  • Cleanroom-compatible materials and lubrication for particle-sensitive environments





Helix delivers the motion that keeps die singulation sharp, accurate, and high-yield ~ every wafer, every cut.



Product Groups

Custom Motion Components for Semiconductor OEMs



Helix Linear Technologies partners with semiconductor equipment OEMs to develop custom lead screws, ball screws, linear actuators, and guide systems tailored for the industry’s most demanding applications. Our components are engineered to resist harsh chemicals, and maintain sub-micron repeatability across millions of cycles.



Whether you’re building wafer processing equipment, automated inspection systems, or high-throughput backend packaging tools, Helix delivers the motion systems that keep semiconductor manufacturing precise, scalable, and future-ready.



Key Benefits:



✦ Sub-micron precision motion for wafer alignment, inspection, and bonding

✦ Cleanroom-compatible designs with low particle generation and dry lubrication

✦ Corrosion- and heat-resistant materials for vacuum, plasma, and chemical exposure

✦ Custom-engineered solutions to integrate seamlessly into OEM equipment





From lithography to laser dicing, Helix powers the motion behind the world’s most advanced semiconductor tools.



Whitepaper
WHITEPAPERSEMICONDUCTORS

Solutions for Semiconductor Manufacturing

Precision Motion Systems for a Demanding Industry

Testimonials

Precision That Powers Automation

"Your stepper motor linear actuators deliver unparalleled performance and precision, a game-changer for our automation needs."

Alan Perry, Stryker
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Driving Innovation Through Collaboration

"The level of responsiveness from your sales engineer and the innovative engineering support provided during the purchase of our custom lead screw were outstanding. Our partnership has truly elevated our product development."

Ken Matthews, Johnson & Johnson
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Expert Support for Complex Medical Engineering

"Your team's customer service went above and beyond, guiding us through the intricate process of custom ball screw engineering. The result? A precision-engineered ball screw that seamlessly integrated into our medical equipment, enhancing its reliability and performance. Kudos to your expertise and exceptional support.”"

John Sidlow, GE Medical
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